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1. INTRODUCTIONOVERVIEW
1. SELF INTRODUCTION.mp4
6.15 MB
1. SELF INTRODUCTION.srt
0.58 KB
2. OVERVIEW OF COURSE CONTENTS.mp4
7.28 MB
2. OVERVIEW OF COURSE CONTENTS.srt
1.38 KB
3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4
20.92 MB
3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt
2.66 KB
4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4
12.62 MB
4. WHY DO WE NEED DEVICE PACKAGING COATING .srt
1.29 KB
5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4
10.52 MB
5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt
1.25 KB
6. HIERARCHY OF ELECTRONICS PACKAGING.mp4
19.25 MB
6. HIERARCHY OF ELECTRONICS PACKAGING.srt
1.89 KB
7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4
11.38 MB
7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt
1.31 KB
8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4
8.91 MB
8. CONCEPT OF CHIP FIRST & CHIP LAST.srt
0.69 KB
2. PACKAGING CONFIGURATIONS
1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4
6.44 MB
1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt
3.12 KB
2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4
14.26 MB
2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt
1.66 KB
3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT
1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4
37.44 MB
1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt
4.24 KB
2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4
19.28 MB
2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt
2.38 KB
3. ELECTRONIC GLASS.mp4
21.28 MB
3. ELECTRONIC GLASS.srt
2.87 KB
4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS
1. INTRODUCTION TO PCB.mp4
9.31 MB
1. INTRODUCTION TO PCB.srt
1.00 KB
2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4
19.90 MB
2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt
2.43 KB
3. FR4 PCB BOARD.mp4
5.58 MB
3. FR4 PCB BOARD.srt
1.91 KB
5. ADVANCED MATERIAL FOR TIM
1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4
17.07 MB
1. USE OF GELVET OVER CONVENTIONAL TIMs.srt
2.02 KB
2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4
14.68 MB
2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt
1.61 KB
6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY
1. INTRODUCTION TO MMCs.mp4
11.95 MB
1. INTRODUCTION TO MMCs.srt
2.35 KB
2. Al-DIAMOND MMC.mp4
11.77 MB
2. Al-DIAMOND MMC.srt
1.64 KB
3. Al-SiC MMC.mp4
11.09 MB
3. Al-SiC MMC.srt
1.79 KB
4. Al-Si MMC.mp4
5.70 MB
4. Al-Si MMC.srt
0.87 KB
5. Cu-DIAMOND MMC.mp4
9.66 MB
5. Cu-DIAMOND MMC.srt
1.55 KB
6. Al-GRAPHITE MMC.mp4
9.21 MB
6. Al-GRAPHITE MMC.srt
1.02 KB
7. GOLD-GOLD INTERCONNECTION (GGI).mp4
14.27 MB
7. GOLD-GOLD INTERCONNECTION (GGI).srt
1.32 KB
8. ROLE OF DIAMOND.mp4
14.86 MB
8. ROLE OF DIAMOND.srt
1.75 KB
9. CARBON NANO TUBES (CNTs).mp4
17.71 MB
9. CARBON NANO TUBES (CNTs).srt
2.02 KB
7. PHASE CHANGE MATERIALS
1. MATERIALS USED IN PCM.mp4
6.11 MB
1. MATERIALS USED IN PCM.srt
2.53 KB
8. ELECTROMAGNETIC SHIELDING (EMI)
1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4
9.63 MB
1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt
0.83 KB
1.1 RESOURCE.pdf
3.88 MB
9. COURSE CLOSING SESSION
1. CONCLUSION.mp4
14.20 MB
1. CONCLUSION.srt
1.54 KB
2. CLOSING SESSION.mp4
4.56 MB
2. CLOSING SESSION.srt
0.80 KB
Bonus Resources.txt
0.35 KB
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